MITAC passiv CPU-køler til Intel LGA4677 1U-server (M50FCP)

Data center technicians deploying Intel Xeon Scalable processors in 1U rackmount servers need a cooling solution that balances thermal performance with space constraints. The MITAC EGSM1UHSSTD passive CPU heatsink is engineered for Intel LGA4677 sockets, specifically for the Intel M50FCP server family, delivering reliable heat dissipation without a dedicated fan. Its passive design relies on system airflow, making it ideal for high-density environments where every millimeter counts.

Key specifications

• Cooler type: Passive heatsink (no fan included)
• CPU socket compatibility: Intel LGA4677 (Socket E)
• Supported CPU series: Intel Xeon Scalable (Sapphire Rapids)
• Server form factor: 1U rackmount
• Thermal design power (TDP) support: Up to 205W with proper system airflow
• Heatsink material: Copper base with aluminum fins
• Heatpipe material: Copper
• Mounting mechanism: Screw-down via CPU retention module
• Thermal paste pre-applied: No
• Application: Server, data center
• Cooling method: Passive convection
• Compatibility note: Requires adequate system airflow for optimal performance

Why choose it

This heatsink is purpose-built for Intel's 1U M50FCP server platform, ensuring a precise fit and optimal thermal interface. Its copper base and heatpipes efficiently transfer heat away from the CPU, while the aluminum fins maximize surface area for heat dissipation. By eliminating a fan, it reduces power consumption and potential points of failure, contributing to overall system reliability. The screw-down mounting provides secure attachment, preventing movement during shipping or operation.

Ideal use cases

• Deploying Intel Xeon Scalable processors in 1U rack servers
• Upgrading or replacing the stock heatsink in Intel M50FCP systems
• Building high-density data center environments where passive cooling is preferred
• Maintaining consistent thermal performance in servers with strong chassis airflow

Good to know

Because this is a passive cooler, it is essential to ensure that your server chassis provides sufficient airflow across the heatsink. Inadequate airflow may lead to higher CPU temperatures. The heatsink does not come with pre-applied thermal paste; a high-quality thermal interface material should be applied before installation. Always verify compatibility with your specific server model and CPU before purchase.