Supermicro - CPU-kølelegeme SNK-P0087V

Passive CPU heatsink engineered for 1U server environments, delivering reliable thermal management for Intel Xeon Scalable processors up to 165W TDP without a dedicated fan. Its dense aluminium fin array and copper base efficiently transfer heat to the system airflow, ensuring stable operation in space-constrained chassis.

Advantages

Optimised for 1U rack servers, this heatsink utilises a narrow ILM mounting pattern for secure installation on LGA3647 sockets. The pre-applied thermal grease simplifies assembly, while the screw-in design guarantees consistent contact pressure. All-aluminium fins with a copper base provide excellent heat dissipation in passive cooling scenarios.

Suitable for

• Supermicro 1U server chassis requiring passive cooling
• Intel Xeon Scalable processors (1st, 2nd, 3rd Gen) with narrow ILM
• Data centres and edge deployments prioritising low acoustic noise
• Systems with high static pressure airflow from chassis fans

Key specifications

• Heatsink type: Passive (no integrated fan)
• Socket compatibility: Intel LGA3647 (Narrow ILM)
• Supported CPU series: Intel Xeon Scalable (1st, 2nd, 3rd Gen)
• Max TDP: 165W
• Material: Aluminium fins, copper base
• Thermal interface: Pre-applied thermal grease
• Mounting: Screw-in
• Form factor: 1U

Recommendations

Verify that your chassis provides adequate airflow across the heatsink. For optimal performance, pair with high-static-pressure fans and ensure proper ventilation in the rack.