Supermicro - CPU-kølelegeme SNK-P2083P

Data centre technicians deploying 1U rackmount servers with Intel Xeon Scalable processors need a reliable cooling solution that fits tight vertical clearances. The Supermicro SNK-P2083P passive heatsink is engineered for LGA3647 sockets, offering a copper base and aluminium fins that dissipate up to 205W of heat without a fan. Its low-profile design is ideal for high-density environments where airflow is provided by chassis fans.

Key specifications

• Socket compatibility: Intel LGA3647
• Heatsink type: Passive (no fan)
• Maximum TDP: 205W
• Server form factor: 1U rackmount
• Material: Copper base, aluminium fins
• Dimensions (L x W x H): 108 x 78 x 27 mm
• Weight: 0.45 kg
• Mounting: Screw-in with pre-applied thermal interface material
• Designed for: Supermicro X11 / X12 series motherboards
• Supported CPU series: Intel Xeon Scalable (1st, 2nd, 3rd Gen)

Why choose it

This heatsink is a genuine Supermicro component, ensuring perfect fit and performance for your server. Its passive design eliminates moving parts, reducing failure points and noise. The copper base provides excellent thermal conductivity, while the aluminium fins maximise heat dissipation in forced-air environments. It supports both single and dual processor configurations.

Ideal use cases

• 1U rackmount servers in data centres
• High-density computing clusters
• Supermicro X11 and X12 platforms
• Systems requiring reliable passive cooling

Good to know

The SNK-P2083P includes pre-applied thermal interface material for quick installation. Adequate system airflow is required for optimal cooling performance. This heatsink is compatible with Intel Xeon Scalable processors up to 205W TDP.