Supermicro CPU-køler 1U til Socket 4677 passiv SNK-P0087VW

In dense 1U server environments, managing the thermal load of high-TDP Intel Xeon Scalable processors without adding noise or consuming valuable rack space is a constant challenge. The Supermicro SNK-P0087VW passive CPU heatsink directly addresses this by providing efficient, silent cooling for LGA4677 sockets, relying on system airflow rather than a dedicated fan. Its low-profile design is engineered to fit within strict 1U height constraints, making it an ideal thermal solution for data centers and edge deployments where reliability and space efficiency are paramount.

Who is it for

This heatsink is built for IT administrators, system integrators, and data center operators deploying Supermicro 1U rackmount servers or workstations based on 4th Gen Intel Xeon Scalable processors (Sapphire Rapids). It is particularly suited for environments that demand quiet operation, such as office-adjacent server rooms or noise-sensitive edge locations, while still supporting processors with a TDP of up to 270W when paired with adequate chassis airflow.

Main features

• Passive cooling design eliminates fan noise and reduces points of failure.
• Compatible with Intel LGA4677 (Socket E) for Xeon Scalable processors.
• Supports processors up to 270W TDP with proper system airflow.
• Low-profile 1U form factor (27.5 mm height) fits slim server chassis.
• Copper base and aluminum fins ensure efficient heat transfer.
• Screw-down mounting provides secure attachment to the motherboard.

Specifications

• Cooler Type: CPU Heatsink
• Cooling Method: Passive (no fan)
• Socket Compatibility: Intel LGA4677
• Supported Processors: Intel Xeon Scalable (Sapphire Rapids)
• Max TDP: 270W
• Heatsink Material: Aluminum fins, copper base
• Dimensions (L x W x H): 113 x 80 x 27.5 mm
• Form Factor: 1U Rackmount
• Mounting Type: Screw-down
• Fan Included: No
• Brand Compatibility: Supermicro

Tips

To achieve optimal cooling performance, ensure your server chassis provides sufficient directed airflow across the heatsink fins. Verify that your motherboard and chassis are compatible with LGA4677 mounting and that the heatsink does not interfere with adjacent components such as DIMM slots or power connectors. For high-TDP processors, confirm that your system's thermal design can deliver the required airflow to maintain safe operating temperatures.